Product Description:
The LCS3588 core module, built on the Rockchip RK3588 chip platform, is a meticulously designed, full-featured module with dimensions of only 65mm by 50mm. It connects to the baseboard using four 100Pin board-to-board connectors with a 0.4mm pitch, secured by four M2 screws. This setup ensures full utilization of all RK3588 external pin signals while supporting high-speed data transmission, various stacking height options, automation assembly compatibility, vibration resistance, a wide operating temperature range, and high reliability. It also adheres to environmental standards and features an error-proof design with quality materials and surface treatment, meeting the demands of harsh environments and high-speed communication.
The LCS3588 includes the RK3588 CPU, LPDDR4/LPDDR4X DDR (available in 2GB, 4GB, 8GB, and 16GB configurations), high-speed eMMC 5.1 storage (with options ranging from 32GB to 128GB), and a PMU composed of the RK806 and multiple DC-DC and LDO components, with CPU core voltages supporting DVFS (Dynamic Voltage and Frequency Scaling). With its modular design, the LCS3588 ensures all CPU functional pins are accessible, thoroughly tested, and verified. This approach helps users save development time, reduce costs, and improve efficiency.
Features:
- Product Name: System On Module SoM
- Best system on module available in the market
- Compact and powerful SoM module
- Integrated with the latest technology
- Highly reliable and efficient
- Offers high performance computing
- Compatible with various operating systems
- Supports multiple communication protocols
- Flexible and scalable design
- Easy to integrate and interface with other systems
- Low power consumption
- Ideal for embedded and IoT applications
Technical Parameters:
| Function | Description |
| CPU | RK3588S 8nm; 8-core 64-bit processor architecture (4A76 + 4A55) |
| GPU | ARM Mali-G610 MC4; Supports OpenGL ES 1.1/2.0/3.1/3.2; Vulkan 1.1/1.2;
OpenCL 1.1/1.23/2.0; High-performance 2D image acceleration module. |
| NPU | 6TOPS computing power / 3-core architecture; Supports
int4/int8/int16/FP16/BF16/TF32. |
| VPU | Supports H.265/H.264/AV1/VP9/AVS2 video decoding, up to 8K60FPS;
Supports H.264/H.265 video encoding, up to 8K30FPS. |
| DDR | LPDDR4, with options for 4GB/8GB/16GB. |
| eMMC | eMMC 5.1, with options for 32GB/64GB/128 GB. |
| PMU | RK806 |
| OS | Android / Ubuntu / Buildroot / Debian |
| Video Input Interface | MIPI interface :
2 * MIPI(4 lanes) + 4 * MIPI(2 lanes), totally support 6 cameras input;
3 * MIPI(4 lanes) + 2 * MIPI(2 lanes), totally support 5 cameras input;
4 * MIPI(4 lanes) , totally support 4 cameras input;
DVP interface:
8/10/12/16-bit standard DVP interface, up to 150MHz input data;
HDMI RX interface:
HDMI 2.0 2160p@60 Hz, Support HDCP2.3 and HDCP1.4; |
| Video Output Interface | 1 * HDMI2.1 up to 8K@60fps;
1 * HDMI2.0 up to 4K@60fps;
2 * MIPI-DSI up to 4K@60fps;
2 * DP1.4 up to 8K@30fps;
2 * eDP1.3 up to 4K@60Hz;
1 * BT.1120 up to 1080@60fps; |
| Image Signal Processor | 8064*6048@15 dual ISP;
6528*4898@30 dual ISP;
4672*3504@30 single ISP; |
| Video Output Processor | Video Port0 up to 7680*4320@60Hz;
Video Port1 up to 4096*4320@60Hz; |
| Operating temperature | Enterprise Grade: -20°C to 70°C
Industrial Grade: -40°C to 85°C |
| PCB interface | B2B(400 Pin 0.4mm Pitch) |
| PCB layers | 12 layers |
| PCB size | L* W *H(mm):65 *50 * 4.74 |
Support and Services:
Our System On Module (SoM) product comes with comprehensive technical support and services to ensure seamless integration of the SoM into your product. Our technical support team is available to assist with any questions or issues that may arise during the development process. We also offer customization services to meet specific project requirements, including hardware and software modifications. Our team of experts can provide design reviews and recommendations to optimize performance and reduce development time. Additionally, we offer training and documentation to ensure that our customers have the knowledge and tools necessary to use the SoM effectively.
Packing and Shipping:
Product Packaging for System On Module (SoM) Product:
The SoM product will be packaged in a sturdy cardboard box with foam inserts to ensure safe transportation. The box will have the company logo and product name printed on it for easy identification. Inside the box, the SoM product will be wrapped in an anti-static bag to protect against electrostatic discharge during shipping.
Shipping for System On Module (SoM) Product:
The SoM product will be shipped via a trusted courier service, such as UPS or FedEx, to ensure timely and secure delivery. The shipping label will include the company name and address as well as the recipient's address. The product will be insured during shipping to protect against any potential damage or loss.
FAQ:
Q: Where is the System On Module manufactured?
A: The System On Module is manufactured in Shanghai, China.
Q: What is the brand name of the System On Module?
A: The brand name of the System On Module is Neardi.
Q: What is the minimum order quantity for the System On Module?
A: The minimum order quantity for the System On Module is 1 piece.
Q: What are the payment terms for the System On Module?
A: The payment terms for the System On Module are L/C, D/A, D/P, and T/T.
Q: What is the supply ability of the System On Module?
A: The supply ability of the System On Module is 10000 pieces per month.
Q: What is the delivery time for the System On Module?
A: The delivery time for the System On Module is 7 days.
Q: What are the packaging details for the System On Module?
A: The packaging details for the System On Module are 33.5×19×9 cm.
Q: Is the price of the System On Module negotiable?
A: Yes, the price of the System On Module is negotiable.
